1. After -sales service acceptance conditions
1). Customers who need to be returned and exchanged due to the incorrect number of receipt, the model inconsistent, and the quality of the product quality. The return and exchange application can be submitted within two weeks after receiving the goods.
2). Return and exchange products, please keep the complete original packaging (including outer packaging, internal filling) and ensure that the goods label is intact.If there is a loss, it will not be able to return.
3). If you apply for a return due to product quality problems, customers need to provide detailed English version of performance testing report as a basis for negotiation with the supplier of Shenzhen Haihong Microelectronics Co., Ltd.If necessary, a third -party English test report that both parties recognized.
4). The order that has issued an invoice must be returned to the invoice after the return application is passed.
2. After -sales service is not accepted
1). The original packaging and the label of the product are damaged.
2). Products that have been used/tested on the machine.
3). The receiving time exceeds two weeks (the delivery date of the courier is subject to).
4). The invoice has been issued.
5). Customers' own reasons for mistakes.
3. Submit after -sales steps
1) Users can on the [Member Center] - [My Order] page, search for the order number or product model through the search order number or product model.
2) Enter the after -sales details page. After filling in, save it according to the prompts. The customer service staff of Shenzhen Haihong Microelectronics Co., Ltd. will contact you in time and communicate with you.
4. After -sales service processing time
After the user submits a after -sales application, the customer service staff of Shenzhen Haihong Microelectronics Co., Ltd. will accept and feedback within two working days.
According to the latest data from market research firm IDC, the global smartphone market declined for the first time sin...
As AI chips have increasingly higher requirements for performance and integration, advanced packaging and substrate tech...